SU TS - Buehler
2021-3-25u2002·u2002for controlling cutting and grinding of the thin section. To grind the thin section, it is moved into the path of the grinding wheel as the micrometer accurately advances the thin section. Depending on the hardness and the friability of the specimen, 10-20µm of the specimen surface can be removed in one pass. Ultra-Thin Section Preparation
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